Tris(dimethylamido)aluminum [Al(NMe2)3]2 is solid at room temperature (melting point 90°C). [Al(NMe2)3]2 was reported to be useful as MOCVD precursor at the temperatures down to 200°C.
Tris(diethylamido)aluminum [Al(NEt2)3]2 is a non-pyrophoric liquid aluminum precursor. [Al(NEt2)3]2 is dimeric
also in liquid phase, has reasonable vapor pressure (0.2Torr/100°C) and decomposition point >240°C.[[i]]
[i] AirLiquide
[Al(NEt2)3]2 was proposed as Al precursor for the Al2O3 deposition by ALD, as well as for the growth of HfAlO films in cocktail mixture with Hf(NEt2)4. []
Tris(diethylamido)aluminum [Al(NEt2)3]2 was shown to be a useful precursor to aluminum nitride (AlN) thin films by MOCVD [[i]]
[i] J. Vac. Sci. Technol. 14, 306, (1996)
Aluminum bis(dimethylamide) (N-ethyl-N’,N’dimethylethylenediamide) Al(NMe2)2(NEt-CH2CH2NMe2)
, combined with NH3, was applied as Al precursor for the growth of amorphous AlN layers by MOCVD in mild conditions (growth temperatures from 150°C to 400°C).[i]
[i] S.T. Barry, R.G. Gordon, V.A. Wagner, Mat. Res. Soc. Symp. Proc., 2000, p.? (Chemical Processing of Dielectrics, Insulators and Electronic Ceramics).